Lumentum, Qualcomm, Corning Team Up to Light Up AI’s Next Interconnect Leap

‼️ 🧠 BREAKING: Lumentum (LITE), Qualcomm (QCOM), and Corning (GLW) announced a joint board-level demonstration at ECOC 2026 showcasing a high-density die-to-die optical interconnect for AI scale-up architectures, integrating Qualcomm’s D2D interface IP subsystem, Lumentum’s VCSEL-based optical interconnect platform, and Corning’s multimode fiber connectivity.